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ELECTROARC POWER ENGINEERING
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Insulation Cover

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Pole Cap

Silicon Pole Cap

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Potting Compound

Silicon Potting Compound

Protection Sleeve

Silicon Potting Compound

Silicon Potting Compound Specification

Usage
Potting, coating, and encapsulating

Components
Base and curing agent

Thermal Conductivity
0.8 1.2 W/mK

IP Rating
IP67 after curing

Features
Excellent electrical insulation, waterproof, UV and chemical resistant

Operating Temperature
-50C to +200C

Product Type
Two-component silicone potting compound

Application
LED drivers, transformers, power modules, electronics

Rated Voltage
Up to 1000V

Size
Standard 1 kg, 5 kg, and 20 kg kits

Dimension (L*W*H)
Packaged dimensions vary (custom on request)

Function
Encapsulation and protection of electronic components

Color
Transparent or White

Weight
Approximately 1 kg (varies by packaging)

Thickness
Recommended 2 mm and above

Capacity
As per pack size

Viscosity
25006500 cps (depending on grade)

Mix Ratio (by weight)
10:1 (Base:Hardener)

Dielectric Strength
>18 kV/mm

Elongation at Break
60% to 120%

Cure Time
6-24 hours at room temperature

Hardness (Shore A)
25-60 (varies by type)

Flame Retardancy
UL 94 V-0 Grade (for some types)

Toxicity
Non-toxic after curing

Storage Conditions
Cool, dry place below 25C

Shelf Life
12 Months when unopened

Specific Gravity
1.05 1.25 g/cm

Packaging Type
Plastic/metal bucket or cartridge

About Silicon Potting Compound

Silicon Potting Compound is a synthetic substance that is in high demand within electrical and electronic applications to build protective shield over circuit elements to protect them from moisture attacks. It is also beneficial to prevent risks of short circuits. The high mechanical strength and vibration resistance of this compound makes it highly demanding and popular among our customers. The offered Silicon Potting Compound is available in different densities and colors as per our clients demands. Customers can get this thermal resistant viscous substance in large volumes within sealed packages.

Reliable Encapsulation for Electronics

This Silicon Potting Compound assures superior protection for sensitive electronic components. Its robust electrical insulation, waterproofing, UV resistance, and chemical durability extend the lifetime of devices, whether used in LED drivers, transformers, or power modules. Its versatility in application and pack sizes suits any scale, from small repairs to large industrial batches.

Efficient Application and Versatile Features

Easy to mix (10:1 ratio), this compound exhibits consistent viscosity for smooth pouring and thorough coverage. It cures at room temperature within 6-24 hours, forming a tough, flexible layer with recommended thickness above 2 mm. Once cured, it achieves IP67-level waterproofing and offers excellent dielectric strength and thermal management.

Safe Handling and Long Shelf Life

The compound is non-toxic post-curing and can be safely handled with basic precautions. When kept in a cool, dry environment below 25C, it retains optimal quality for up to 12 months unopened. Packaged conveniently in plastic or metal, it arrives ready for immediate use and supports a variety of industrial needs.

FAQ's of Silicon Potting Compound:

Q: How do I mix and apply the Silicon Potting Compound for best results?

A: Mix the base and hardener at a 10:1 ratio by weight. Stir thoroughly until the mixture is uniform, then pour into the mold or directly onto the component. Ensure a minimum thickness of 2 mm for effective protection. The material will cure in 6-24 hours at room temperature.

Q: What are the main benefits of using this potting compound for electronic components?

A: Key benefits include excellent electrical insulation (>18 kV/mm), reliable waterproofing (IP67 after cure), UV and chemical resistance, flame retardancy (UL 94 V-0 for certain types), and enhanced thermal management. These properties extend component life and ensure safe, long-term operation.

Q: When should I use this compound and in what applications?

A: Use the Silicon Potting Compound whenever you need to encapsulate, protect, or insulate electronic components like LED drivers, transformers, power modules, and other sensitive electronics. It is suitable for potting, coating, and encapsulation in both industrial and small-scale environments.

Q: Where should I store the potting compound for maximum shelf life?

A: Store unopened containers in a cool, dry place below 25C. Under these conditions, the material remains effective for up to 12 months. Avoid exposure to direct sunlight or high temperatures to maintain quality.

Q: What is the curing process and how long does it take?

A: After mixing, the compound should be applied as needed and will begin curing at room temperature. Depending on the grade and environmental conditions, full curing takes between 6 and 24 hours. No special equipment is needed for room temperature curing.

Q: Is this potting compound safe to handle, and are there any toxicity concerns?

A: The compound is non-toxic after curing. Follow standard safety guidelines while handling the uncured mixture and ensure adequate ventilation during application. Once fully cured, it is safe for use in all electronic applications.

Q: What pack sizes are available and can the packaging be customized?

A: Standard pack sizes are 1 kg, 5 kg, and 20 kg, typically supplied in plastic or metal buckets or cartridges. Custom dimensions are available upon request to suit specific application needs or bulk orders.

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